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? design assistance ? assembly assistance ? die handling consultancy ? hi - rel die qualification ? hot & cold die probing ? electrical test & trimming ? customised pack sizes / qtys ? support for all industry recognised ? 100% visual inspection contact baredie@micross.com for price, delivery and to place orders h m c1057 supply formats: o waffle pack o gel pak o tape & reel ? onsite storage, stockholding & scheduling ? on - site failure analysis ? bespoke 24 hour monitored storage systems for secure long term product support o mil - std 883 condition a o mil - std 883 condition a ? on - site failure analysis www.analog.com www.micross.com
analog devices welcomes hittite microwave corporation no content on the attached documen t has changed www.analog.com www.hittite.com
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mixers - sub harmonic - chip 1 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz general description features functional diagram passive: no dc bias required high input ip3: 13 dbm [2] high lo/rf isolation: 30 db high 2lo/rf isolation: 50 db wide if bandwidth: dc - 12 ghz upconversion & downconversion applications die size: 1.74 x 1.73 x 0.1 mm electrical specifcations, t a = +25 c, if = 4 ghz, lo = +13 dbm, usb [1] typical applications the hmc1057 is ideal for: ? short haul / high capacity radios ? test equipment & sensors ? military end-use ? e-band communications systems ? automotive radar the hmc1057 is a sub-harmonically pumped mmic mixer which can be used as either an image reject mixer (irm) or a single sideband upconverter. this passsive mmic mixer is fabricated with gaas shottky diode technology. for downconversion applications, an external quadrature hybrid can be used to select the desired sideband while rejecting image signals. all bond pads and the die backside are ti/au metallized and the shottky devices are fully passivated for reliable operation. all data shown herein is measured with the chip in a 50 ohm environment and contacted with rf probes. parameter min. typ. max. units rf frequency range 71 - 86 ghz if frequency range dc - 12 ghz lo frequency range 29 - 43 ghz conversion loss 12 15 db 2lo to rf isolation 50 db lo to rf isolation 30 db lo to if isolation 35 db rf to if isolation 25 db ip3 (input) [2] +13 dbm [1] unless otherwise noted , all measurements performed as an downconverter with lo = +13 dbm [2] upconverter performance . for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 2 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz conversion gain, usb vs. temperature data taken as irm with external if 90 hybrid, if = 4000 mhz conversion gain, usb vs. lo drive image rejection, usb vs. temperature image rejection, usb vs. lo power rf return loss lo return loss -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +25 c +85 c -55 c conversion gain (db) rf frequency (ghz) -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +25 c +85 c -55 c image rejection (dbc) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +25 c return loss (db) rf frequency (ghz) -25 -20 -15 -10 -5 0 20 25 30 35 40 45 50 +25 c return loss (db) lo frequency (ghz) for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 3 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz rf/if isolation lo isolation data taken as irm with external if 90 hybrid, if = 4000 mhz if return loss -25 -20 -15 -10 -5 0 0 3 6 9 12 15 if1 if2 return loss (db) if frequency (ghz) -60 -50 -40 -30 -20 -10 0 60 65 70 75 80 85 90 rf/if1 rf/if2 isolation (db) rf frequency (ghz) -70 -60 -50 -40 -30 -20 -10 0 30 33 36 39 42 45 2lo/rf lo/rf lo/if1 lo/if2 isolation (db) lo frequency (ghz) upconverter performance conversion gain, usb upconverter performance conversion gain vs. input power, usb upconverter performance sideband rejection , usb -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +25 c conversion gain (db) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +25 c sideband rejection (dbc) rf frequency (ghz) -25 -20 -15 -10 -5 0 75 78 81 84 87 90 0 dbm -4 dbm -8 dbm -10 dbm -12 dbm conversion gain (db) rf frequency (ghz) for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 4 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz data taken as irm with external if 90 hybrid, if = 4000 mhz upconverter performance input ip3, usb conversion gain, lsb vs. lo drive image rejection, lsb vs. lo drive -10 -5 0 5 10 15 20 60 65 70 75 80 85 90 +25 c ip3 (dbm) rf frequency (ghz) -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) upconverter performance conversion gain, lsb -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +25 c conversion gain (db) rf frequency (ghz) upconverter performance sideband rejection , lsb 0 10 20 30 40 50 60 62 64 66 68 70 72 74 76 78 80 82 +25 c sideband rejection (dbc) rf frequency (ghz) upconverter performance input ip3, lsb 0 5 10 15 20 25 60 65 70 75 80 85 90 -3 dbm ip3 (dbm) rf frequency (ghz) for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 5 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz data taken as irm with external if 90 hybrid, if = 500 mhz conversion gain, usb vs. temperature conversion gain, usb vs. lo drive image rejection, usb vs. temperature image rejection, usb vs. lo drive conversion gain, lsb vs. lo drive image rejection, lsb vs. lo drive -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +25 c +85 c -55 c conversion gain (db) rf frequency (ghz) -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) 0 10 20 30 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +25 c +85 c -55 c image rejection (dbc) rf frequency (ghz) for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 6 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz data taken as irm with external if 90 hybrid, if = 2000 mhz conversion gain, usb vs. temperature -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +25 c +85 c -55 c conversion gain (db) rf frequency (ghz) conversion gain, usb vs. lo drive -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) image rejection, usb vs. temperature 0 10 20 30 40 50 60 65 70 75 80 85 90 +25 c +85 c -55 c image rejection (dbc) rf frequency (ghz) image rejection, usb vs. lo drive 0 10 20 30 40 50 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) conversion gain, lsb vs. lo drive -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) image rejection, lsb vs. lo drive 0 10 20 30 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 7 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz data taken as irm with external if 90 hybrid, if = 8000 mhz conversion gain, usb vs. temperature conversion gain, usb vs. lo drive image rejection, usb vs. temperature image rejection, usb vs. lo drive conversion gain, lsb vs. lo drive image rejection, lsb vs. lo drive -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +25 c +85 c -55 c conversion gain (db) rf frequency (ghz) -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) 0 10 20 30 40 50 60 65 70 75 80 85 90 +25 c +85 c -55 c image rejection (dbc) rf frequency (ghz) for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 8 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz data taken as irm with external if 90 hybrid, if = 12000 mhz conversion gain, usb vs. temperature -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +25 c +85 c -55 c conversion gain (db) rf frequency (ghz) conversion gain, usb vs. lo drive -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) image rejection, usb vs. temperature 0 10 20 30 40 50 60 65 70 75 80 85 90 +25 c +85 c -55 c image rejection (dbc) rf frequency (ghz) image rejection, usb vs. lo drive 0 10 20 30 40 50 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) conversion gain, lsb vs. lo drive image rejection, lsb vs. lo drive 0 10 20 30 40 50 60 65 70 75 80 85 90 +11 dbm +13 dbm image rejection (dbc) rf frequency (ghz) -25 -20 -15 -10 -5 0 60 65 70 75 80 85 90 +11 dbm +13 dbm conversion gain (db) rf frequency (ghz) for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 9 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz table 1. absolute maximum ratings rf power (lo = 13 dbm) +7. 5 d b m lo drive (rf = -10 dbm) +20 dbm if power +5 dbm maximum junction temperature 175 c thermal resistance (r th ) (junction to die bottom) 258 c/w operating temperature -55 c to +85 c storage temperature -65 c to 150 c electrostatic sensitive device observe handling precautions outline drawing table 2. die packaging information [1] standard alternate gp-1 (gel pack) [2] [1] for more information refer to the packaging information document in the product support section of our website. [2] for alternate packaging information contact hittite microwave corporation. notes: 1. all dimensions are in inches [mm]. 2. die thickness is 0.004 3. bond pads 1, 2 & 3 are 0.0059 [0.150] x 0.0039 [0.099]. 4. backside metallization: gold. 5. bond pad metallization: gold. 6. backside metal is ground. 7. connection not required for unlabeled bond pads. 8. o verall die size 0 .002 for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 10 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz table 3. pad descriptions pad number function description pad schematic 1 rf this pad is matched to 50 ohms. 2, 4 if1, if2 these pads are matched to 50 ohms. 3 lo this pad is ac coupled and matched to 50 ohms. die bottom gnd die bottom must be connected to rf/dc ground assembly diagram for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 11 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general han - dling, mounting, bonding note). 50 ohm microstrip transmission lines on 0.127mm (5 mil) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). one way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should be located as close to the die as possible in order to minimize bond wire length. typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waffle or gel based esd protec - tive containers, and then sealed in an esd protective bag for shipment. once the sealed esd protective bag has been opened, all die should be stored in a dry nitrogen environment. cleanliness: handle the chips in a clean environment. do not attempt to clean the chip using liquid cleaning systems. static sensitivity: follow esd precautions to protect against > 250v esd strikes. transients: suppress instrument and bias supply transients while bias is applied. use shielded signal and bias cables to minimize inductive pick- up. general handling: handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. the surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fngers. mounting the chip is back-metallized and can be die mounted with ausn eutectic preforms or with electrically conductive epoxy. the mounting surface should be clean and fat. eutectic die attach: a 80/20 gold tin preform is recommended with a work surface temperature of 255 c and a tool temperature of 265 c. when hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 c. do not expose the chip to a temperature greater than 320 c for more than 20 seconds. no more than 3 seconds of scrubbing should be required for attachment. epoxy die attach: apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fllet is observed around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturers schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recom - mended. use the minimum level of ultrasonic energy to achieve reliable wirebonds. wirebonds should be started on the chip and terminated on the package or substrate. all bonds should be as short as possible <0.31mm (12 mils). 0.102mm (0.004?) thick gaas mmic wire bond rf ground plane 0.127mm (0.005?) thick alumina thin film substrate 0.076mm (0.003?) figure 1. 0.102mm (0.004?) thick gaas mmic wire bond rf ground plane 0.254mm (0.010?) thick alumina thin film substrate 0.076mm (0.003?) figure 2. 0.150mm (0.005?) thick moly tab for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com
mixers - sub harmonic - chip 12 hmc1057 v01.0413 gaas mmic sub harmonic i/q mixer, 71 - 86 ghz notes: for price, delivery and to place orders: hittite microwave corporation, 2 elizabeth drive, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com application support: phone: 978-250-3343 or apps@hittite.com

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